Silicon Wafer Form Factor

Tuam txhab Taw Qhia

NtawmZhonggui Semiconductor, peb manufacturing ethos yog anchored nyob rau hauvkwv yees scaling thiab cov khoom sib xws. Peb tuav ib tug stabilized txhua hli throughput ntawm10,000 units, tshwj xeeb hauv high-purity synthesis ntawm hluav taws xob-qib monocrystalline thiab advanced compound semiconductor platforms. Txhua lub substrate yog calibrated kom tau raws li qhov nrujtopographical qauvtxhais los ntawm qib thoob ntiaj teb -ib txoj cai kev lag luam.

Precision substrate refinementPeb lub zog tseem ceeb yog nyob rau hauv kev txhais cov neeg siv khoom tshwj xeeb hauv kev ua tau zoo- npaj kho vajtse. Peb qhov chaw ua haujlwm sib xyaw ua ke- muaj peev xwmprecision pob zeb diamond-hlau slicing, tswj kev sib tsoo, thiabsub-nanometer nto planarization- tau ua tib zoo tu raws li qhov yuav tsum tau ua ntawm engineering. Los ntawm kev tswj xyuas nruj metrological, peb muab qhov siab -kev ncaj ncees lub hauv paus xav tau rau kev sib koom ua ke ntawm cov cuab yeej siab.

Lub cev daim ntawv ntawm cov silicon substrates yog meticulously optimized los xyuas kom meej qhov siab tshaj plawstuav stabilitynyob rau hauv complex industrial workflows. Txhawb nqa tag nrho txoj kab uas hla ntawm2-nti (50mm) rau 12-nti (300mm), cov geometries no yog engineered los ua ib tug nruj, siab -fidelity interface ntawm raw khoom thiab siab - ceev robotic processing systems.

Core Technical Advantages:

Txhim kho Alignment Precision:Dimensional sib xws yog tswj ntawm sub-micron tolerances, ua kom yooj yim kom raug thiab rov ua kom zoo dua qub thaum lub sij hawm siab - daws teeb meem photolithography thiab wafer- rau -wafer bonding. Qhov kev ncaj ncees ntawm cov qauv no txo ​​qhov kev pheej hmoo ntawm cov qauv overlay yuam kev thiab cov txheej txheem drift.

Optimized Dynamic Resilience:Cov substrates yog tsim los ua kom ntseeg tau raws li qhov sib txawv ntawm cov khoom siv sib txawv, suav nrog siab -ceev centrifugation thiab nqus chucking. Qhov kev tiv thaiv no txo ​​qis kev ntxhov siab -induced micro- tawg, txhim kho tag nrho cov cuab yeej kev ntseeg siab.

Txheej txheem Variation Mitigation:Los ntawm streamlining ntug profileing thiab nto flatness, daim ntawv no minimizesparticle tiamthiab turbulence thaum lub sij hawm ua cov tshuaj, ncaj qha mus rau kev txhim kho wafer- theem tawm los nyob rau hauv niaj hnub 300mm foundry ib puag ncig.

Ntim

Peb cov wafers polished tau ntim nrog cov khoom tshwj xeeb - lub hom phiaj wafer nkoj, uas tom qab ntawd muab tso rau hauv txhuas lub hnab rau lub tshuab nqus tsev sealing. Txoj kev ntim khoom no muaj kev tiv thaiv kev ruaj ntseg tiv thaiv oxidation, noo noo nkag thiab cov kab mob sib kis, yog li tswj xyuas qhov huv thiab zoo tag nrho ntawm cov wafers. Rau cov neeg siv khoom uas xav tau ib tus neeg wafers, peb kuj muab cais ib leeg -wafer ntim thawv.

Cov wafers hauv av thiab 12-inch silicon wafers tau ua haujlwm nrog kev saib xyuas thiab ntim rau hauv lub ncuav mog qab zib puag ncig- cov thawv zoo li lub thawv lossis cov thawv ua npuas dej uas muaj cov ntawv sib cais. Cov txheej txheem txheej txheem no zoo tiv thaiv khawb, ntug chipping thiab lwm yam kev puas tsuaj thaum thauj thiab tuav cov txheej txheem, yog li ua kom muaj kev ncaj ncees ntawm cov wafers.

FAQ

Q: Koj cov nqe lus xa khoom yog dab tsi?

A: Peb txais EXW, FOB (feem ntau Xiamen), CFR, CIF, DDP, DDU, thiab lwm yam. Koj tuaj yeem xaiv qhov yooj yim tshaj plaws thiab tus nqi - kev xaiv zoo.

Q: Lub sijhawm ua haujlwm rau kev kuaj thiab ntau lawm yog dab tsi?

A: Cov qauv:1-3 hnub tom qab tau txais tus nqi coj mus kuaj thiab kev pom zoo.

Kev tsim khoom loj:Feem ntau 25-28 hnub rau cov qauv xaj, lossis 30-45 hnub nyob ntawm seb muaj pes tsawg thiab lub caij.

Prototyping:Kwv yees li 7 hnub tom qab kos duab pom zoo.

Cim npe nrov: Tuam Tshoj silicon wafer form factor manufacturers, lwm tus neeg, Hoobkas